Films and getters · Future bench (tested)

ALD alumina and aluminide barriers

ALDvalues describe: ALD Al₂O₃

Fusion, privateSemiconductor equipment & lithography

What it enables

Tritium and hydrogen permeation barriers on steel, and conformal coatings inside complex parts.

Status and pusher

Coating-on-steel demonstrations; integration into blanket designs. Pushed by fusion programs and the ALD industry.

Properties

The values below are candidate: compiled from the sources named, not yet individually validated. Provisional provenance: EUROfusion and international fusion materials programmes; Semiconductor chamber materials and plasma-resistant coating literature.

Wet cleaning

Recipesubstrate cleaned to semiconductor standard before deposition
Forbiddenparticles: one particle is one pinhole
LimitPRF of 1e3 to 1e5 depends entirely on defect density

Vacuum and outgassing

Outgassing, unbaked (10 h)reduces substrate outgassing
Vapour pressurenone

Temperature

Bake, assembled450 °C
Vacuum degassubstrate
Metallurgical limitsubstrate

Thermal

CTEsubstrate
Thermal conductivitysubstrate

Mechanical

Strengthcoating
Elongationnil
Density3 g/cm3

Electrical and magnetic

Relative permeability1.0
Resistivity>1e14 Ω·cm

Engineering

Corrosionexcellent barrier
Joiningconformal, coats internal geometry
Process notestritium permeation barrier, and outgassing barrier
Availability and costemerging in fusion and accelerator programmes
Sources · 1
  1. EUROfusion materials program

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