The Matter

Material properties

The 85 cards as one sortable table. The signature column is the outgassing drop from a raw surface to a baked one, drawn from the sourced base and never from an unsourced number. Every value is candidate until validated.

85 of 85 materials

Compare
316LNAustenitic stainless 304L / 316L / 316LN ESRSteels and superalloysWorkhorse39 sourced1050 °Csolution anneal 1040–1120 °C; sensitisation 425–815 °C avoided by L gradesalkaline degrease, DI rinse, electropolish…16 ppm/K15 W/m·K0.15–0.25 polished, 0.6–0.8 oxidised150–200 HV7.95 g/cm31375–1400 °C
IN718Inconel 718 / 625Steels and superalloysWorkhorsenot in the base yet1100 °Csolution 980–1065 °C then age 720/620 °Calkaline degrease, DI rinse; pickle only wi…13 ppm/K11.4 W/m·K0.2–0.3380–450 HV8.19 g/cm31260–1336 °C
Al 6063Aluminum 6061 / 6063 / 5083Light metalsWorkhorse12 sourced300 °C (vacuum degas)T6 temper lost above 200 °Cmild alkaline or neutral detergent, DI rins…23.6 ppm/K167 W/m·K0.04–0.06 bare, 0.8 anodised95–107 HV2.7 g/cm3582–652 °C
TiTitanium Gr 2 / Ti-6Al-4VLight metalsWorkhorse4 sourced900 °Cβ transus 882 °C (Gr 2)alkaline degrease, DI rinse, nitric-HF pick…8.6 ppm/K17 W/m·K0.2145–160 HV4.51 g/cm31668 °C
BeBerylliumLight metalsWorkhorse1 sourced900 °Coxidises above 700 °C in airwet machining and wet cleaning only, in a c…11.5 ppm/K200 W/m·K0.1 polished~150 HV1.85 g/cm31287 °C
Cu OFEOxygen-free copper C10100 / C10200CoppersWorkhorse10 sourced1000 °Crecrystallises from 200 °Calkaline degrease, DI rinse, citric or sulp…16.5 ppm/K391 W/m·K0.03–0.05 polished, 0.6 oxidised40–60 HV annealed8.96 g/cm31085 °C
CuCrZrCuCrZr and GlidCop (dispersion-strengthened Cu)CoppersWorkhorsenot in the base yet980 °CCuCrZr ageing 460–500 °C; GlidCop does not recrystalliseas OFE: degrease, DI, mild bright dip, ultr…17 ppm/K320 CuCrZr, 365 GlidCop W/m·K0.05 polished120–140 HV8.9 g/cm31070–1083 °C
WTungstenRefractoriesWorkhorse3 sourced1800 °Crecrystallises 1300–1400 °Cdegrease, DI rinse; alkaline electrolytic c…4.5 ppm/K174 W/m·K0.05 polished RT, 0.35 at 2000 K350–450 HV19.25 g/cm33422 °C
Mo/TZMMolybdenum and TZMRefractoriesWorkhorse2 sourced1500 °CMo recrystallises 1100–1200 °C; TZM holds ~1400 °Cdegrease, DI rinse, alkaline electro-clean;…5 ppm/K138 W/m·K0.10 polished RT150–250 HV10.22 g/cm32623 °C
NbNiobium RRR 300RefractoriesWorkhorsenot in the base yet1400 °Crecrystallises ~1000 °Cthe most codified recipe in the field: BCP…7.3 ppm/K53 W/m·K0.160–100 HV8.57 g/cm32477 °C
Al2O3Alumina 94 to 99.8 percentCeramics and glassesWorkhorsenot in the base yet1500 °Cservice to 1700 °Csolvent degrease, DI rinse, then fire 900–1…7.6 ppm/K30 W/m·K0.7–0.91400–1800 HV3.9 g/cm32072 °C
SaSapphireCeramics and glassesWorkhorsenot in the base yet1600 °Cservice to 1800 °Csolvent then piranha or RCA-type clean for…5.3 ppm/K35 W/m·K0.3–0.9 by wavelength2000+ HV3.98 g/cm32040 °C
SiO2Fused silica and borosilicate (Kodial)Ceramics and glassesWorkhorse3 sourced1100 °Cannealing point 1140 °C, softening 1665 °Cdetergent, DI rinse, then RCA or piranha fo…0.55 silica; 4.9 Kodial ppm/K1.4 W/m·K0.9600–700 HV2.2 g/cm31665 soft. °C
Y2O3Yttria coatings (APS)Ceramics and glassesWorkhorsenot in the base yet600 °C (vacuum degas)stable to 1500 °CDI rinse and dry only, after grit-blast pre…8 ppm/K13 W/m·K0.8500–700 HV5.01 g/cm32410 °C
SiCSilicon carbide (CVD)Ceramics and glassesWorkhorsenot in the base yet1400 °Cservice to 1600 °C inert; protective oxide above 1200 °C in airsolvent, then SC-1 / SC-2 wet bench for fab…4.2 ppm/K120–200 sintered, 250–300 CVD W/m·K0.8–0.92500–2800 HV3.21 g/cm32730 dec. °C
ULEULE and Zerodur (near-zero CTE)Ceramics and glassesWorkhorsenot in the base yet300 °C (vacuum degas)Zerodur ceramises above 600 °C; ULE anneals ~1000 °Coptical clean only: detergent, DI, solvent…0 ± 0.03 ppm/K1.3 W/m·K0.9600 HV2.21 ULE, 2.53 Zerodur g/cm31490 soft. °C
FKMViton (FKM)Polymers and elastomersWorkhorse1 sourced200 °C (vacuum degas)continuous 200 °C, excursion 250 °Clint-free wipe with isopropanol, air dry, t…160 ppm/K0.2 W/m·K0.975–90 Shore A1.85 g/cm3
PIPEEK, Kapton (polyimide), VespelPolymers and elastomersWorkhorse4 sourcedisopropanol wipe or short ultrasonic in IPA…0.9
KvKovar (FeNiCo)Joints and magneticsWorkhorsenot in the base yet1100 °CCurie 435 °Calkaline degrease, DI rinse, then wet-hydro…5.5 ppm/K17 W/m·K0.2–0.3130–160 HV8.36 g/cm31450 °C
MuMMu-metal and CryopermJoints and magneticsWorkhorsenot in the base yet1150 °Canneal 1100–1175 °C in H₂: and the anneal is lastdegrease and DI rinse before the final anne…12.7 ppm/K35 W/m·K0.2120 HV8.75 g/cm31425 °C
InIndiumJoints and magneticsWorkhorsein the base, no rate157 °Cmelts 157 °Cwipe the sealing faces with IPA; use the wi…32.1 ppm/K82 W/m·K0.1very soft7.31 g/cm3157 °C
NEGTiZrV NEG filmFilms and gettersWorkhorsein the base, no signature250 °C (vacuum degas)activation 180–200 °Cthe substrate is cleaned to UHV standard be…substratesubstrate0.55.8 g/cm3
ZrVFeBulk getters: St707 class, ZAOFilms and gettersWorkhorsein the base, no rate500 °C (vacuum degas)activation 450–500 °C; ZAO activates lower and tolerates airnever wet-clean an activated getter; handle…0.66.5 g/cm3
RuRuthenium capping layersFilms and gettersWorkhorsenot in the base yetoxidises to volatile RuO₄ under oxidising plasmahydrogen radical cleaning in situ, not wet…6.4 ppm/K117 W/m·K0.212.45 g/cm32334 °C
BBoron and lithium wall conditioningFilms and gettersWorkhorsenot in the base yetthe film is consumed and reapplied each campaignnot applicable: the wall is conditioned in…2.34 g/cm32076 (B) °C
ZnZinc, and therefore brassJoints and magneticsBanned2 sourcednot applicable20.5 ppm/K120 W/m·K8.5 g/cm3900–940 °C
CdCadmium platingJoints and magneticsBannednot in the base yetnot applicable30.8 ppm/K97 W/m·K8.65 g/cm3321 °C
SnPbLead and standard solder jointsJoints and magneticsBannednot in the base yet183 °CTHE CONDEMNING NUMBER: melts at 183 °C, so it caps the bakeout of every system it touchesif it must be present: ultrasonic flux remo…25 ppm/K50 W/m·K0.18.4 g/cm3183 °C
303Free-machining steels (303, 12L14)Steels and superalloysBannednot in the base yetnot applicable17.3 ppm/K16 W/m·K8 g/cm31400 °C
FeMild steel and cast iron, bareSteels and superalloysBanned2 sourcednot applicable in UHV12 ppm/K50 W/m·K0.7 oxidised7.87 g/cm31500 °C
PTFEPTFE (Teflon)Polymers and elastomersBanned3 sourced200 °C (vacuum degas)THE CONDEMNING MECHANISM: cold flow under any sustained load, far below its 327 °C meltIPA wipe, then bake135 ppm/K0.25 W/m·K0.950–55 Shore D2.2 g/cm3327 °C
Si-OSiliconesPolymers and elastomersBanned1 sourcednot applicable300 ppm/K0.2 W/m·K0.91.1 g/cm3
NBRStandard elastomers (Buna-N, EPDM)Polymers and elastomersBanned3 sourcedTHE CONDEMNING NUMBER: 100–120 °C maximum, so no real bakeout is possible, on top of the worst outgassing rate in common useIPA wipe if used in rough vacuum230 ppm/K0.25 W/m·K0.970–80 Shore A1.2 g/cm3
PVCPVC, nylon, acrylicPolymers and elastomersBanned9 sourcedTHE CONDEMNING MECHANISM: plasticiser for PVC, water absorption for nylon, and PVC releases chloride that attacks stainlessnot applicable70 ppm/K0.19 W/m·K0.91.4 g/cm3
AlOxAnodized aluminum inside UHVLight metalsBanned1 sourcedTHE CONDEMNING MECHANISM: the anodic layer is a columnar porous oxide with an enormous internal area, sealed by hot water: you have engineered a water sponge onto the surfacenot applicable: the sealing step is itself…23.6 ppm/Kreduced by the layer0.8400–600 HV2.7 g/cm3
GlueGeneric adhesives and tapesPolymers and elastomersBannednot in the base yetTHE CONDEMNING MECHANISM: uncharacterised chemistry, no cure schedule, and silicone-adhesive tapes bring the siloxane problem with themnot applicable
TiZrHfVQuaternary NEG films (TiZrHfV)Films and gettersFuturenot in the base yet200 °C (vacuum degas)activation 150–180 °C, lower than TiZrVsubstrate cleaned before coating; the film…substratesubstrate~6 g/cm3
a-CAmorphous carbon coatingsFilms and gettersFuturenot in the base yetgraphitises above 400 °Csubstrate cleaned to UHV standard before sp…substratesubstrate0.81500–2500 HV2 g/cm3
LESSLaser-engineered surface structuresFilms and gettersFuturenot in the base yetsubstrateopen question: the structured surface traps…substratesubstrateraised deliberately, up to 0.9
AM TiPrinted chambers: Ti-6Al-4V, AlSi10MgAdditiveFuturenot in the base yet920 °CHIP 920 °C / 100 MPa closes porosityHIP, then machine the sealing faces, then c…8.6 ppm/K7 W/m·K0.4 as-built340 HV4.43 g/cm31604–1660 °C
AM CuPrinted pure copper (green laser) and SLM niobiumAdditiveFuturenot in the base yet900 °Crecrystallises from 200 °Cunresolved: internal channels cannot be ver…17 ppm/K250–350, below wrought W/m·K0.1 as-built70–90 HV8.7–8.9 g/cm31085 °C
YOFYF3 and YOF coatingsCeramics and glassesFuturenot in the base yet600 °C (vacuum degas)stable to 1200 °CDI rinse and dry; aerosol-deposited films a…8 ppm/K13 W/m·K0.8500–700 HV5.01 g/cm32410 °C
YAGBulk Y2O3 and YAG partsCeramics and glassesFuturenot in the base yet1000 °C (vacuum degas)stable to 1500 °Cas a dense ceramic: solvent, DI rinse, bake8 ppm/K13 W/m·K0.81200 HV5.03 g/cm32410 °C
C*CVD diamond windowsCeramics and glassesFuturenot in the base yet1000 °C (vacuum degas)graphitises above 700 °C in vacuumsolvent, then acid clean for optical grades…1 ppm/K1800–2200 W/m·K0.0310 000 HV3.52 g/cm3
EUROFERRAFM and ODS steels (EUROFER97, F82H)Steels and superalloysFuturenot in the base yet1000 °C (vacuum degas)tempering 750 °C; service limited to ~550 °Cnot established for fusion service11 ppm/K29 W/m·K7.8 g/cm31450 °C
SiC/SiCSiC/SiC compositesCeramics and glassesFuturenot in the base yet1200 °C (vacuum degas)service above 1000 °C in fusion conditionsnot established4.5 ppm/K15–30 through thickness W/m·K0.92.5–3.1 g/cm32730 dec. °C
Wf/WTungsten composites (fiber, laminate)RefractoriesFuturenot in the base yet1500 °C (vacuum degas)as W, with the interface as the weak pointnot established4.5 ppm/K~150 W/m·K~18 g/cm33422 °C
Li/SnLiquid metal PFCs (Li, Sn, capillary porous systems)Liquid metalsFuturenot in the base yetLi melts 181 °C, Sn 232 °Cnot applicable: the surface renews itself,…0.53 Li, 7.3 Sn g/cm3181 / 232 °C
ALDALD alumina and aluminide barriersFilms and gettersFuturenot in the base yetsubstratesubstrate cleaned to semiconductor standard…substratesubstrate3 g/cm3
Nb3SnNb3Sn films on copper cavitiesFilms and gettersFuturenot in the base yet1100 °CTc 18 Kthe substrate gets the full SRF cleaning be…8.9 g/cm3
2DGraphene and 2D membranesFilms and gettersFuturenot in the base yettransfer chemistry is the whole difficulty;…-8, negative ppm/K2000–4000 in-plane W/m·K
TaTantalumRefractoriesWorkhorsenot in the base yet2000 °Crecrystallises ~1100 °Cdegrease and DI rinse; nitric-HF etch where…6.5 ppm/K57 W/m·K0.190–120 HV16.65 g/cm33017 °C
W-ReRhenium and W-Re / Mo-Re alloysRefractoriesWorkhorsenot in the base yet1800 °Cno DBTT problem: that is the point of the rheniumdegrease, DI rinse, hydrogen fire4.8 ppm/K70–100 W/m·K0.1400–500 HV19.7 (W-25Re) g/cm33000–3180 °C
NiNickel and nickel platingSteels and superalloysWorkhorse4 sourced1100 °CCurie 358 °Calkaline degrease then DI rinse; activate i…13.3 ppm/K70 W/m·K0.1 polished~110 HV8.9 g/cm31455 °C
A286UHV fastener alloysSteels and superalloysWorkhorsenot in the base yet1100 °Csolution 900 °C then age 720 °Cdegrease only; plated bolts are used as del…16.5 ppm/K12.6 W/m·K0.2–0.3~300 HV7.94 g/cm31370–1400 °C
AM350Bellows steelsSteels and superalloysWorkhorsenot in the base yet1000 °Canneal 930 °C, age 850 °Cdegrease and DI rinse; convolutions trap fl…11.9 ppm/K15 W/m·K0.2~400 HV7.91 g/cm31400 °C
InvarInvar 36Steels and superalloysWorkhorsenot in the base yet1000 °CCurie 230 °C: the anomaly ends theredegrease, DI rinse, dry immediately1.5 ppm/K13 W/m·K0.2–0.3130–150 HV8.1 g/cm31427 °C
C-22Hastelloy C-22 / C-276Steels and superalloysWorkhorsenot in the base yet1120 °Csolution anneal 1120 °Celectropolish to the SEMI gas-system finish…12.4 ppm/K10.1 W/m·K0.2–0.3~200 HV8.69 g/cm31325–1370 °C
CuBeCopper beryllium C17200CoppersWorkhorsenot in the base yet500 °C (vacuum degas)age 315–345 °C; over-ageing kills the springdegrease and DI rinse only; wet handling of…17 ppm/K105 W/m·K0.05350–400 HV8.25 g/cm3865–955 °C
NbTiNbTi superconducting wireRefractoriesWorkhorsenot in the base yetTc 9.5 K; the Cu matrix anneals from 200 °Cas delivered; the insulation and the matrix…~8 ppm/K0.1 at 4 K W/m·K6 g/cm3
WHATungsten heavy alloysRefractoriesWorkhorsenot in the base yet900 °C (vacuum degas)liquid-phase sintered; binder softens above 900 °Cdegrease and DI rinse; the binder phase is…5.4 ppm/K70–90 W/m·K0.2280–350 HV17.0–18.5 g/cm3binder melts ~1450 °C
AlNAluminum nitride and ShapalCeramics and glassesWorkhorsenot in the base yet1200 °Cdissociates ~2200 °C; oxidises in air above 800 °Csolvent wipe and dry; if aqueous is unavoid…4.5 ppm/K170–200 polycrystalline, 285–320 single crystal W/m·K0.81100–1200 HV3.26 g/cm32200 dec. °C
MacorMacor machinable glass-ceramicCeramics and glassesWorkhorse4 sourced800 °C (vacuum degas)continuous 800 °C, softens 1000 °Csolvent degrease then long bake: machined s…9.3 ppm/K1.46 W/m·K0.9250 HV2.52 g/cm31000 soft. °C
BeOBerylliaCeramics and glassesWorkhorsenot in the base yet1500 °Cservice to 1800 °Cwet processes only, in a controlled enclosu…7.5 ppm/K270 W/m·K0.71200 HV3.01 g/cm32507 °C
PBNPyrolytic boron nitrideCeramics and glassesWorkhorsenot in the base yet1600 °Cstable to 2000 °C in vacuum or inertsolvent wipe and dry only1.0 in-plane, 20 through ppm/K60 in-plane, 2 through W/m·K0.92.15 g/cm32973 sub. °C
QzSemiconductor quartzwareCeramics and glassesWorkhorsenot in the base yet1200 °Cdevitrifies above 1200 °C in servicethe fab standard: HF etch to strip deposits…0.55 ppm/K1.4 W/m·K0.9600–700 HV2.2 g/cm31665 soft. °C
CaF2Crystal window materialsCeramics and glassesWorkhorsenot in the base yet200 °C (vacuum degas)cleaves and cracks under thermal shockdry solvent drag-wipe only, methanol or ace…18.9 ppm/K9.7 W/m·K160 HV3.18 g/cm31418 °C
SiSingle-crystal silicon partsCeramics and glassesWorkhorsenot in the base yet1200 °Cmelts 1414 °CRCA: SC-1 for particles and organics, HF di…2.6 ppm/K150 W/m·K0.61000 HV2.33 g/cm31414 °C
CGraphite, pyrolytic graphite, glassy carbonCarbon and compositesWorkhorsein the base, no rate2000 °Csublimes above 3000 °C in vacuumdo not wet-clean porous grades: solvent ent…4.5 iso; 0.5 in-plane pyrolytic ppm/K100 iso; 300–1900 in-plane pyrolytic W/m·K0.8–0.95soft, machinable1.8 iso, 2.2 pyrolytic g/cm33650 sub. °C
TiNTitanium nitride filmsFilms and gettersWorkhorsenot in the base yetoxidises above 550 °C in airsubstrate cleaned to UHV standard before co…9.4 ppm/K29 W/m·K0.42000–2400 HV5.22 g/cm32930 °C
Fe3O4Ferrites and lossy ceramicsCeramics and glassesWorkhorsenot in the base yet400 °C (vacuum degas)Curie 100–400 °C by grade; above it the damping is gonesolvent wipe, dry; porous grades bake rathe…8–10 ppm/K3–6 W/m·K0.9600 HV4.8–5.2 g/cm31400 dec. °C
CuSSColaminated Cu beam screensCoppersWorkhorsenot in the base yet600 °C (vacuum degas)the copper layer recrystallises from 200 °Cas OFE on the copper face, with the steel s…16–17 copper face ppm/K391 in the copper skin W/m·K0.05 copper face8.4 composite g/cm31085 (Cu) °C
B4CBoron carbideCeramics and glassesWorkhorse2 sourced1500 °Coxidises above 600 °C in airsolvent and DI rinse, dry; hot-pressed grad…5 ppm/K30–40 W/m·K0.92800–3200 HV2.52 g/cm32450 °C
AgCuVacuum braze alloysJoining and consumablesWorkhorsenot in the base yet600 °C (vacuum degas)BAlSi-2 solidus 577 °C to Palco 1219 °Cboth faying surfaces degreased and oxide-fr…19.6 ppm/K2018355 W/m·K0.059.9 g/cm3577-1219 °C
AuSnVacuum and hermetic soldersJoining and consumablesWorkhorsenot in the base yet280 °CAuSn eutectic 280 °Cfluxless reflow under forming gas or vacuum…16 ppm/K57 W/m·K0.114.5 g/cm3280 °C
EpxVacuum-rated epoxiesJoining and consumablesWorkhorsein the base, no signature150 °C (vacuum degas)Tg 60–150 °C by systemsubstrates solvent-cleaned and abraded befo…60 ppm/K0.2 W/m·K0.91.15 g/cm3
MoS2The vacuum lubrication ladderJoining and consumablesWorkhorsenot in the base yetMoS₂ oxidises in humid air, which is why it is stored drysubstrate cleaned and grit-blasted before s…5.06 g/cm3
FFKMPerfluoroelastomers (Kalrez, Chemraz)Polymers and elastomersWorkhorsenot in the base yet300 °C (vacuum degas)250–325 °C by compoundIPA wipe, air dry, vacuum bake 200 °C befor…200 ppm/K0.2 W/m·K0.970–90 Shore A2 g/cm3
Z306Vacuum black coatingsFilms and gettersWorkhorsenot in the base yetZ306 binder degrades; Acktar is inorganicAcktar: solvent wipe only, it is a vacuum-d…substratesubstrate0.90–0.99, which is the point
CFRPCFRP with cyanate ester resinsCarbon and compositesWorkhorsenot in the base yet200 °C (vacuum degas)Tg 250 °C cyanate ester; epoxy far lowersolvent wipe only, then long vacuum bake at…-0.5 to 2 along fibre ppm/K5–50 along fibre W/m·K0.91.6 g/cm3no melt
Rb/CsAlkali metal dispensersFilms and gettersWorkhorsenot in the base yetactivation by resistive heating, 550–800 °C at the dispensernever: the dispenser arrives sealed and is…Rb 39, Cs 28 °C
REBCOREBCO high temperature superconductor tapesFilms and gettersFuturenot in the base yetTc 92 K; the tape delaminates under transverse stressas delivered; the tape architecture is seal…
Sc2O3Scandate cathodesFilms and gettersFuturenot in the base yet1200 °C (vacuum degas)activation 1100–1200 °Cnever: the impregnant is water reactive
V-4-4Vanadium alloy V-4Cr-4TiSteels and superalloysFuturenot in the base yet1000 °C (vacuum degas)recrystallises ~1100 °Cnot established9.7 ppm/K31 W/m·K6.1 g/cm31910 °C
Li4SiO4Breeder ceramics and multipliersCeramics and glassesFuturenot in the base yetservice 300–900 °Cnot applicable: hygroscopic and reactive~2 W/m·K2.4 g/cm31250 °C

Column guide

Outgassing signature
The specific outgassing rate on a logarithmic scale, mbar·L/s/cm², drawn from the sourced base at /tools/outgassing/. The axis runs from 1e-18 on the left to 4.00e-5 on the right, recomputed from the data at every build rather than fixed, so no value can fall off either end. The cardinal mark is the worst rate on an unbaked surface, the ink the best on a baked or vacuum-fired one, and the bar between them is the drop. A rate means nothing without the pumping time it was read at, which is why every entry behind this bar states its species, its surface state, its treatment, its measurement temperature and its pumping time, or declares which of them the source withheld. The base holds that sentence from its most cited source: Chiggiato states in section 4 of the CERN Accelerator School notes that without expressly mentioning the pumping time, any value of the water outgassing rate is meaningless. Hover a bar for its readings, their span in decades and the source keys behind them. Cards marked not in the base yet carry unsourced values on their own page that this column no longer reads. Two other marks say what the base holds when it cannot draw a bar. In the base, no signature means the card carries sourced rates without the unbaked and baked pair a drop needs. In the base, no rate means the card is named with declared absences or prescriptions only, which is what happens when a source publishes a quantity of gas rather than a rate: a quantity has no time in it and converts into no unit of this axis. Sorted by the conservative worst case, the highest unbaked rate.
Process max (°C)
Bare-part process ceiling: the higher of vacuum degassing and hydrogen brazing. When the brazing figure is missing or not applicable, the cell names the leaf it actually reports. Not the assembled-system bake, which is on the material page with its condition.
Metallurgical limit
Where the material itself changes: recrystallisation, Curie point, decomposition.
Wet cleaning
The pre-bake wet recipe, truncated; the full text is on the material page.
CTE (ppm/K)
Coefficient of thermal expansion.
κ (W/m·K)
Thermal conductivity.
Emissivity
Total hemispherical emissivity: in vacuum every heat path is radiative.
Hardness
Indentation hardness, scale as noted.
Density (g/cm3)
Bulk density.
Melting (°C)
Melting or softening point.
Candidate
Every value here is compiled, not yet individually validated. Provisional provenance and the full block, including per-grade values, are on each material page.

Take the data

Everything behind this table is served as one document at /data/matter-materials.json: the 85 cards with their whole property blocks, the grade ladders this table collapses to one row each, the source registry that resolves every per-value key, and the schema that names its 30 parameters. That link is the guaranteed path, and it works with scripting turned off.

The CSV button writes the rows you are looking at, filters and sort order included, reading the table itself rather than a second copy of the data, so the file and the page cannot drift apart. It carries what each cell shows, with the full text where the column truncates. Per-value provenance stays in the JSON.

/data/matter-materials.json

Data CC BY 4.0, Mean Free Path, Pierre F. Ribault. Build date 2026-09-07: the JSON envelope states it, the CSV filename repeats it.

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