Additive · Future bench (tested)

Printed chambers: Ti-6Al-4V, AlSi10Mg

AM Tivalues describe: Ti-6Al-4V SLM

Quantum hardwareBig science (accelerators, light sources, public fusion)

What it enables

Topology-optimized monolithic UHV chambers, 70 percent lighter: printed titanium holds low 1e-10 mbar with outgassing indistinguishable from a conventional flange, and 2-year vacuum holds are demonstrated.

Status and pusher

Driven by quantum sensor programs (Birmingham and Nottingham lineage) and commercial chamber makers.

Watch out

Porosity and virtual leaks are process-control problems, largely solved for LPBF.

Properties

The values below are candidate: compiled from the sources named, not yet individually validated. Provisional provenance: Additive manufacturing vacuum qualification studies.

Wet cleaning

RecipeHIP, then machine the sealing faces, then chemical polish internal surfaces if access allows, then bake long
Forbiddentrusting an as-built internal surface; trapped powder is a virtual leak you cannot find
Limitpowder removal from internal channels, and how you would verify it

Vacuum and outgassing

Outgassing, unbaked (10 h)5e-9 mbar·L/s/cm²
Outgassing, baked5e-12 mbar·L/s/cm²
Vapour pressurenegligible

Temperature

Bake, assembled500 °C
Vacuum degas750 °C
Braze / H2 firing920 HIP °C
Metallurgical limitHIP 920 °C / 100 MPa closes porosity

Thermal

CTE8.6 ppm/K
Thermal conductivity7 W/m·K
Specific heat560 J/kg·K
Emissivity0.4 as-built
Melting / softening1604–1660 °C

Mechanical

Strength900–1100 ys MPa
Tensile1000–1200 MPa
Elongation8–14 %
Young's modulus110 GPa
Hardness340 HV
Density4.43 g/cm3

Electrical and magnetic

Relative permeability1.00005
Resistivity170 µΩ·cm

Engineering

Corrosionas wrought
Joiningweldable after HIP
Process notesas-built roughness multiplies effective area by 2–5×
Availability and costservice bureaux
Sources · 3
  1. Vovrosh et al., AM flange and shielding, Sci Rep 2018
  2. AM UHV chamber for portable quantum technologies
  3. AM for advanced quantum technologies, review

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Essays

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