YAGvalues describe: sintered Y₂O₃
Semiconductor equipment & lithographyChipmakers (foundries & IDMs)
What it enables
Coating failure modes disappear when the part is the ceramic.
Status and pusher
Entering high-value etch positions. Pushed by the ceramic majors.
Properties
The values below are candidate: compiled from the sources named, not yet individually validated.
Provisional provenance: Semiconductor chamber materials and plasma-resistant coating literature.
Wet cleaning
| Recipe | as a dense ceramic: solvent, DI rinse, bake |
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| Forbidden | none noted |
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| Limit | unlike the sprayed coating, there is no porosity to trap fluid |
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Vacuum and outgassing
| Outgassing, unbaked (10 h) | 1e-9 mbar·L/s/cm² |
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| Outgassing, baked | 1e-12 mbar·L/s/cm² |
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| Vapour pressure | none |
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Temperature
| Bake, assembled | 450 °C |
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| Vacuum degas | 1000 °C |
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| Metallurgical limit | stable to 1500 °C |
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Thermal
| CTE | 8 ppm/K |
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| Thermal conductivity | 13 W/m·K |
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| Specific heat | 450 J/kg·K |
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| Emissivity | 0.8 |
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| Melting / softening | 2410 °C |
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Mechanical
| Strength | 150–200 flex MPa |
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| Elongation | nil |
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| Young's modulus | 170 GPa |
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| Hardness | 1200 HV |
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| Density | 5.03 g/cm3 |
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Electrical and magnetic
| Relative permeability | 1.0 |
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| Resistivity | >1e14 Ω·cm |
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Engineering
| Corrosion | plasma resistant without the coating porosity |
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| Process notes | the bulk answer to coating particulation |
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| Availability and cost | emerging |
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Sources · 1
- Y-based coating stability studies
← The Matter