Joining and consumables · Workhorse

Vacuum and hermetic solders

AuSnvalues describe: 80Au-20Sn

Quantum hardwareVacuum electronics & X-ray sourcesSpace test

Why it wins

Below brazing temperatures, hermeticity still exists: AuSn eutectic seals quantum and photonic packages fluxless at 280 C, indium alloys join at temperatures optics survive.

Why not the alternative

SnPb and fluxed solders are banned: flux residues and creep; epoxies are not hermetic over years.

Watch out

AuSn is brittle: design the joint, do not just wet it.

Properties

The values below are candidate: compiled from the sources named, not yet individually validated. Provisional provenance: AWS Brazing Handbook; Morgan Wesgo alloy data.

Wet cleaning

Recipefluxless reflow under forming gas or vacuum, on gold-plated surfaces; plasma clean immediately before
Forbiddenflux of any kind in a hermetic package
Limitgold plating thickness, since the tin consumes it

Vacuum and outgassing

Outgassing, unbaked (10 h)5e-9 mbar·L/s/cm²
Outgassing, baked1e-11 mbar·L/s/cm²
Vapour pressuregold-tin is stable; avoid anything containing Cd, Zn or Pb

Temperature

Bake, assembled200 °C
Vacuum degas250 °C
Braze / H2 firing280 reflow °C
Metallurgical limitAuSn eutectic 280 °C

Thermal

CTE16 ppm/K
Thermal conductivity57 W/m·K
Specific heat150 J/kg·K
Emissivity0.1
Melting / softening280 °C

Mechanical

Strength275 tens MPa
Young's modulus68 GPa
Density14.5 g/cm3

Electrical and magnetic

Relative permeability~1.0
Resistivity16 µΩ·cm

Engineering

Corrosiongood
Joininghermetic die attach and package sealing
Process notesthe fluxless alternative to SnPb, and the reason it exists
Availability and costpreforms from specialist suppliers

Grades

Au80Sn20 eutectic, 280 Cfluxless hermetic lid seal and die attach
In52Sn48, 118 Cgentle joints near aligned optics
Pure In, 157 Ccryogenic compliant joints
Sources · 1
  1. Indium Corporation alloy data

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