AuSnvalues describe: 80Au-20Sn
Quantum hardwareVacuum electronics & X-ray sourcesSpace test
Why it wins
Below brazing temperatures, hermeticity still exists: AuSn eutectic seals quantum and photonic packages fluxless at 280 C, indium alloys join at temperatures optics survive.
Why not the alternative
SnPb and fluxed solders are banned: flux residues and creep; epoxies are not hermetic over years.
Watch out
AuSn is brittle: design the joint, do not just wet it.
Properties
The values below are candidate: compiled from the sources named, not yet individually validated.
Provisional provenance: AWS Brazing Handbook; Morgan Wesgo alloy data.
Wet cleaning
| Recipe | fluxless reflow under forming gas or vacuum, on gold-plated surfaces; plasma clean immediately before |
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| Forbidden | flux of any kind in a hermetic package |
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| Limit | gold plating thickness, since the tin consumes it |
Vacuum and outgassing
| Outgassing, unbaked (10 h) | 5e-9 mbar·L/s/cm² |
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| Outgassing, baked | 1e-11 mbar·L/s/cm² |
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| Vapour pressure | gold-tin is stable; avoid anything containing Cd, Zn or Pb |
Temperature
| Bake, assembled | 200 °C |
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| Vacuum degas | 250 °C |
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| Braze / H2 firing | 280 reflow °C |
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| Metallurgical limit | AuSn eutectic 280 °C |
Thermal
| CTE | 16 ppm/K |
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| Thermal conductivity | 57 W/m·K |
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| Specific heat | 150 J/kg·K |
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| Emissivity | 0.1 |
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| Melting / softening | 280 °C |
Mechanical
| Strength | 275 tens MPa |
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| Young's modulus | 68 GPa |
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| Density | 14.5 g/cm3 |
Electrical and magnetic
| Relative permeability | ~1.0 |
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| Resistivity | 16 µΩ·cm |
Engineering
| Corrosion | good |
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| Joining | hermetic die attach and package sealing |
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| Process notes | the fluxless alternative to SnPb, and the reason it exists |
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| Availability and cost | preforms from specialist suppliers |
Grades
| Au80Sn20 eutectic, 280 C | fluxless hermetic lid seal and die attach |
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| In52Sn48, 118 C | gentle joints near aligned optics |
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| Pure In, 157 C | cryogenic compliant joints |
Sources · 1
- Indium Corporation alloy data
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