ACTORS / BRAZING
CPI company

Palo Alto, US

Vacuum electronics

TWTs, klystrons, precision vacuum brazing

Elcon Precision company

California, US

Ceramic-metal

Active braze, hermetic assemblies

Altair Technologies company

California, US

Ceramic-metal

Brazed ceramic-metal, hermetic packages

Indium company

Clinton, US

Sintering

Ag and Cu sinter paste, NanoFoil reactive foil

Wall Colmonoy company

Michigan, US

Nickel fillers

Nicrobraz fillers, aero brazing

Materion company

Ohio, US

Filler metals

Precious and Ti-bearing fillers, seal materials

Rogers (curamik) company

Arizona, US

AMB substrates

Si3N4 active metal brazed substrates

Varex Imaging company

Salt Lake City, US

X-ray tubes

X-ray tubes, ceramic-metal seals

ORNL lab

Tennessee, US

Nuclear joining

SiC/SiC joining, diffusion bonding

Sandia lab

New Mexico, US

Hermetic seals

Glass-metal and ceramic-metal seals

SLAC lab

California, US

Accelerators

OFE copper RF, UHV brazing

EWI lab

Ohio, US

Process transfer

Industrial brazing and diffusion bonding

JWRI, Osaka lab

Osaka, Japan

Joining science

Active braze, TLP, laser brazing

HIT, State Key Lab lab

Harbin, China

Ceramic-metal

HEA fillers, CMC joining, reinforced fillers

Kyocera company

Kyoto, Japan

UHV feedthroughs

Ceramic-metal, AMB substrates, feedthroughs

QST / JAEA lab

Japan

Fusion divertor

Tungsten monoblocks, HIP, series qualification

ZRIME institute

Zhengzhou, China

Braze fillers

Brazing alloys, flux, R&D

Mitsubishi Materials company

Japan

Die-attach

Sinter paste for power modules

Tanaka Precious Metals company

Tokyo, Japan

Precious fillers

Au, Ag, Pd fillers, sinter paste

NGK / NTK company

Nagoya, Japan

Ceramic-metal

Technical ceramics, ceramic-metal assemblies

Senju Metal company

Tokyo, Japan

Die-attach

Solders and sinter paste

Nihon Superior company

Osaka, Japan

Sintering

Ag sinter paste, solders

KITECH lab

Korea

Manufacturing

Brazing, electronic packaging

AT&M company

Beijing, China

Amorphous foils

Ni amorphous brazing foils for diffusion

ITRI lab

Taiwan

Power electronics

Joining, packaging, power modules

CEA Liten lab

France

Diffusion bonding

W-Cu for ITER, heat exchangers

CERN MME lab

Switzerland

Accelerators

Vacuum brazing, OFE copper

Plansee company

Austria

Refractory metals

X-ray anodes, fusion tungsten, brazed parts

SCHOTT company

Germany

Hermetic seals

Glass-to-metal seals, feedthroughs

Morgan (Wesgo) company

United Kingdom

Active braze

Cusil, Ticusil, Incusil active fillers

Heraeus company

Germany

Die-attach

Ag and Cu sinter paste, AMB substrates

Umicore (BrazeTec) company

Germany

Filler metals

Silver and gold fillers

Institut de Soudure lab

France

Qualification

National braze reference, ATG Brasures

Egide company

France

Hermetic packages

Packages and feedthroughs

TWI lab

United Kingdom

Diffusion bonding

Diffusion bonding and brazing R&D

All actors →The intersection →Brazing in the stack →