Coppers · Workhorse
Oxygen-free copper C10100 / C10200
Cu OFEvalues describe: C10100 OFE
Why it wins
Survives hydrogen brazing without embrittlement, best cheap thermal and electrical conductor, soft enough to seal a CF knife edge. Gaskets, RF structures, cryostat stages (gold-plated at millikelvin).
Why not the alternative
ETP copper blisters in hydrogen brazing; aluminum gaskets do not seal knife edges reliably.
Watch out
Soft, creeps, anneals during bake; silver-plate gaskets above 400 C against sticking.
Properties
The values below are candidate: compiled from the sources named, not yet individually validated. Provisional provenance: CERN Accelerator School, vacuum and materials proceedings; NIST cryogenic material properties database; ASM Handbook: properties, corrosion, heat treatment; O'Hanlon, A User's Guide to Vacuum Technology.
Wet cleaning
| Recipe | alkaline degrease, DI rinse, citric or sulphamic bright dip, ultrapure rinse, dry N₂, assemble within the hour |
|---|---|
| Forbidden | chlorine-bearing etchants; hydrogen firing on ETP grades: blistering |
| Limit | the fresh surface re-oxidises in minutes, so cleaning is scheduled against assembly, not against a spec |
Vacuum and outgassing
| Outgassing, unbaked (10 h) | 1e-9 mbar·L/s/cm² |
|---|---|
| Outgassing, baked | 5e-12 mbar·L/s/cm² |
| Vapour pressure | negligible below 700 °C |
Temperature
| Bake, assembled | 400 °C |
|---|---|
| Vacuum degas | 600 °C |
| Braze / H2 firing | 1000 °C |
| Metallurgical limit | recrystallises from 200 °C |
Thermal
| CTE | 16.5 ppm/K |
|---|---|
| Thermal conductivity | 391 W/m·K |
| Thermal conductivity (cryo) | ~2000 at 4 K, RRR 100 W/m·K |
| Specific heat | 385 J/kg·K |
| Emissivity | 0.03–0.05 polished, 0.6 oxidised |
| Melting / softening | 1085 °C |
Mechanical
| Strength | 70 ys annealed MPa |
|---|---|
| Tensile | 220 MPa |
| Elongation | 45 % |
| Young's modulus | 117 GPa |
| Hardness | 40–60 HV annealed |
| Density | 8.96 g/cm3 |
Electrical and magnetic
| Relative permeability | 0.999994 diamagnetic |
|---|---|
| Resistivity | 1.71 µΩ·cm |
Engineering
| Corrosion | oxidises in air, inert in vacuum |
|---|---|
| Joining | brazes and EB welds; the CF gasket is a cold seal |
| Process notes | never handle bare after cleaning |
| Availability and cost | C10100 to order, C10200 in stock |
Brazing
Sourced pairings
| With | Filler | Atmosphere | Expansion gap at set |
|---|---|---|---|
| Alumina 94 to 99.8 percent | Cusil | vacuum | 0.90 % at 780 °C Oxygen-free copper C10100 / C10200 on the outside over budget |
| Alumina 94 to 99.8 percent | Incusil 15 | vacuum | 0.67 % at 605 °C Oxygen-free copper C10100 / C10200 on the outside over budget |
| Graphite, pyrolytic graphite, glassy carbon / CVD diamond windows / Silicon carbide (CVD) / Aluminum nitride and Shapal | Ticusil | vacuum 1e-5 mm Hg or inert gas | 1.04 % at 780 °C Oxygen-free copper C10100 / C10200 on the outside over budget |
| Oxygen-free copper C10100 / C10200 | named only in prose: not stated in the abstract | vacuum preferred over H2 | no filler identified, nothing to derive |
| Austenitic stainless 304L / 316L / 316LN ESR | named only in prose: not stated in the abstract | vacuum | no filler identified, nothing to derive |
| Kovar (FeNiCo) | Cusil or Nioro or Palcusil 15 | vacuum, H2 or inert gas | 0.62 % at 780 °C Oxygen-free copper C10100 / C10200 on the outside over budget |
| Tungsten | named only in prose: eutectic Au-Cu (and, per the review: Cu-Mn, Au-Cu-Fe, NiCuMn-37, Cu-22TiH2, amorphous Ti-Zr) | vacuum | no filler identified, nothing to derive |
| Tungsten | named only in prose: none: OFE copper cast into the monoblock then HIP or HRP | HIP | no filler identified, nothing to derive |
| Molybdenum and TZM
one built object
titanium-zirconium-molybdenum limiter brazed onto OFC copper, UNS C10100, MIT Plasma Science and Fusion Center | Cusil-ABA or Ticusil or Cusil | furnace, brazing temperature 720 to 880 C depending on the silver alloy | 0.97 % at 779 °C Oxygen-free copper C10100 / C10200 on the outside over budget |
| Austenitic stainless 304L / 316L / 316LN ESR
one built object
twelve-cell Plane Wave Transformer linac structure, Raja Ramanna Centre for Advanced Technology, Indore: twelve discs on four support and cooling tubes, the vacuum tank and its RF port, 101 brazed joints made in a single cycle | Cusil | vacuum furnace at 5e-5 mbar | 0.09 % at 780 °C Austenitic stainless 304L / 316L / 316LN ESR on the outside matched |
| Austenitic stainless 304L / 316L / 316LN ESR
one built object
eight WR159 waveguide runs of the DIII-D lower hybrid current drive high-field-side launcher, each machined from a single bent section with a rectangular vacuum-RF flange at each end, installed in 2025 | Cusil | torch brazing with Stay-Silv white paste flux | 0.09 % at 780 °C Austenitic stainless 304L / 316L / 316LN ESR on the outside matched |
| Austenitic stainless 304L / 316L / 316LN ESR
one built object
vacuum chamber test coupon for the Multi Bend Achromat ring of the Advanced Photon Source Upgrade, carrying a stainless CF flange vacuum-brazed to the OFE copper chamber | named only in prose: a gold brazing alloy. The source names no composition and no AWS class, so no identifier of this catalog is attached. | vacuum brazing | no filler identified, nothing to derive |
| Beryllia
one built object
rectangular waveguide RF window for the Jefferson Lab Free Electron Laser, a warm replacement window at 1500 MHz aiming above 100 kW average power, built and power-tested at the TJNAF | Nioro | not stated by the source | expansion of side B absent: 955 °C is outside the range of copper-ofe (20 to 927 °C), never extrapolated |
| Kovar (FeNiCo)
one built object
second joint of the same Jefferson Lab FEL waveguide window: the OFHC copper frame carrying the BeO disc, brazed onto the copper-plated Kovar flange that provides the vacuum seal | Incusil 10 | vacuum braze oven | 0.59 % at 685 °C Oxygen-free copper C10100 / C10200 on the outside over budget |
| Aluminum nitride and Shapal
one built object
microwave absorber module of the Material Plasma Exposure eXperiment: an array of pyramidal AlN tiles brazed onto a water-cooled Glidcop AL-15 baseplate explosion-bonded to a 316SS plate, eight modules and two cooled flanges welded into a stainless cage to make the complete absorber. Two test articles were built and exposed to an electron beam. | Cusin-1 ABA | not stated by the source | 0.97 % at 775 °C Oxygen-free copper C10100 / C10200 on the outside over budget |
| Molybdenum and TZM
one built object
transition subassembly of the same MPEX microwave absorber: a molybdenum layer sandwiched between two thin copper layers, brazed, then brazed in turn onto the Glidcop baseplate and carrying the AlN tiles | Nicusil 3 | not stated by the source | set temperature absent: no solidus recorded for ag-cu-ni-nicusil-3 |
Preparation
- Mo-Mn then Ni plating
- none
- OFE C10100, ASTM grain size 4 minimum
- not stated by the manufacturer
- OFE copper interlayer
- every brazed stainless surface is copper-electroplated before the brazing cycle
- molymanganese metallization on a quarter-inch band around the surface to be brazed, screen printed and fired at 1450 C, then the metallized area nickel plated and sintered at 1000 C, then light blasting with aluminum oxide particles after the braze
- mask the copper plated KOVAR and apply a light blasting with aluminum oxide particles to clean the beryllia surface
Compatibility
What documents state about this material faced with a filler metal, without the other member of the joint. A statement that names the exact filler comes first. A statement about a whole AWS class comes after it: a class covers dozens of alloys, so it is the weaker of the two, and the corpus never turns one into the other. Last come statements about a pair of base metals that name no filler at all. They are the weakest of the three, and they do not contradict the two above: a table that cannot generalize about a pair can still list a filler class for each metal of that pair separately. The three levels answer three different questions.
- listed35Au/65CuKohl lists this filler for copper, Kovar and nickel brazes.
Conditions and source
Book page 192, table XVI, Brazing filler metals for high-vacuum systems. The table carries its own reserve, printed under it: adapted from the list of a commercial manufacturer, so it relays a manufacturer selection list and not a measurement by the author. The Applications column names base metals and never names the other member of the joint. Row 8 of the table, composition Au 35 and Cu 65, which matches the corpus designation 35Au/65Cu (BAu-3) by name. The corpus entry is statut no-data, motif no source read this pass, so this compatibility statement is the only thing the corpus carries about that alloy and nothing here supplies its melting range. The table says copper without a grade. The corpus carries only oxygen-free copper C10100 and C10200 under copper-ofe, so the entry is narrower than the sentence it records.
W. H. Kohl, Soldering and brazing, Vacuum, volume 14, number 5, pages 175 to 198, 1964, Pergamon Press, PII 0042-207X(64)90858-9
Peer-reviewed review article on soldering and brazing for vacuum devices, republished later in the Handbook of Vacuum Physics edited by A. H. Beck. Table XVI, Brazing filler metals for high-vacuum systems, book page 192, lists 21 filler metals with liquidus, solidus and an Applications column. The table carries its own reserve, printed under it: adapted from the list of a commercial manufacturer. It is therefore a manufacturer selection list relayed by the author, not a measurement of his own, and the Applications column names base metals without naming a partner. The page of each statement is carried by the entry that uses it, never by this registry line.
- listedBAu-1Kohl lists this filler for copper, Kovar and nickel.
Conditions and source
Book page 192, table XVI, Brazing filler metals for high-vacuum systems. The table carries its own reserve, printed under it: adapted from the list of a commercial manufacturer, so it relays a manufacturer selection list and not a measurement by the author. The Applications column names base metals and never names the other member of the joint. Row 9 of the table, composition Au 37.5 and Cu 62.5, which matches the corpus entry BAu-1 exactly. The table says copper without a grade. The corpus carries only oxygen-free copper C10100 and C10200 under copper-ofe, so the entry is narrower than the sentence it records.
W. H. Kohl, Soldering and brazing, Vacuum, volume 14, number 5, pages 175 to 198, 1964, Pergamon Press, PII 0042-207X(64)90858-9
Peer-reviewed review article on soldering and brazing for vacuum devices, republished later in the Handbook of Vacuum Physics edited by A. H. Beck. Table XVI, Brazing filler metals for high-vacuum systems, book page 192, lists 21 filler metals with liquidus, solidus and an Applications column. The table carries its own reserve, printed under it: adapted from the list of a commercial manufacturer. It is therefore a manufacturer selection list relayed by the author, not a measurement of his own, and the Applications column names base metals without naming a partner. The page of each statement is carried by the entry that uses it, never by this registry line.
- does not attackCusilSchwartz reports that a 72Ag-28Cu eutectic filler metal, which the same passage identifies as BAg-8, filled several copper joints with no embrittlement at all, even under the most drastic brazing conditions employed, where zinc, cadmium and phosphorus bearing filler metals embrittled the same base metal.
Conditions and source
Book page 65, chapter 4, in the study of filler-metal induced embrittlement of copper. The passage reads: To narrow the possibilities of embrittlement, a 72Ag-28Cu eutectic filler metal was used to fill several joints, and there was no such embrittlement, even in the most drastic brazing conditions employed. The next sentences identify it: While BAg-8 contains silver as the only addition to copper, the other filler metals are a ternary or quaternary formulation, containing additions of zinc, cadmium, and phosphorus. Cusil is BAg-8 at 72 Ag and 28 Cu, so the filler is named and not projected. FOUR reserves. The SUBSTRATE of the study is tough pitch copper: the same page states that embrittlement occurred only in tough pitch copper, containing oxygen as Cu2O precipitates, but not in phosphorus-deoxidized copper, which is completely free of oxides. The corpus key covers that grade, its Matter card listing C11000 ETP among four grades, but the reading is about THAT grade and not about C10100 or C10200. The result is a NEGATIVE of an experiment and not a general clearance: it says this filler did not embrittle where others did, in that study, under those conditions. The mechanism the chapter proposes turns on the filler being able to reduce copper oxide, and it states that silver cannot act as a reducing agent, which is why this entry is does-not-attack and not merely an absence of record. And nothing here is stated about oxygen-free copper, on which the same chapter warns, page 64, that improper heating may oxidise it and make it subject to hydrogen embrittlement in its turn.
M. M. Schwartz, Brazing, 2nd edition, ASM International, 2003, chapter 4, Base Metals and Base-Metal Family Groups, DOI 10.1361/brse2003p063
Chapter 4 of the second edition, book pages 63 to 162 in the copy read, which treats base metals family by family and states metallurgical reactions, atmosphere limits and filler selection guides. It is a handbook chapter, not a qualification record. The page of each statement is carried by the entry that uses it, never by this registry line.
- wetsNioroKohl states that this filler will wet tungsten and molybdenum as well as copper, Kovar, nickel and stainless steel, with excellent flow.
Conditions and source
Book page 192, table XVI, Brazing filler metals for high-vacuum systems. The table carries its own reserve, printed under it: adapted from the list of a commercial manufacturer, so it relays a manufacturer selection list and not a measurement by the author. The Applications column names base metals and never names the other member of the joint. Row 13 of the table, composition Ni 18 and Au 82, which matches the corpus entry Nioro BAu-4 exactly. The table says copper without a grade. The corpus carries only oxygen-free copper C10100 and C10200 under copper-ofe, so the entry is narrower than the sentence it records.
W. H. Kohl, Soldering and brazing, Vacuum, volume 14, number 5, pages 175 to 198, 1964, Pergamon Press, PII 0042-207X(64)90858-9
Peer-reviewed review article on soldering and brazing for vacuum devices, republished later in the Handbook of Vacuum Physics edited by A. H. Beck. Table XVI, Brazing filler metals for high-vacuum systems, book page 192, lists 21 filler metals with liquidus, solidus and an Applications column. The table carries its own reserve, printed under it: adapted from the list of a commercial manufacturer. It is therefore a manufacturer selection list relayed by the author, not a measurement of his own, and the Applications column names base metals without naming a partner. The page of each statement is carried by the entry that uses it, never by this registry line.
- listedAWS class BAgThe AWS combination table lists the BAg class for brazing this base metal to Cu and Cu alloys, carbon and low-alloy steels, cast iron, stainless steel, Ni and Ni alloys, Ti and Ti alloys, Be, Zr, V and alloys, reactive metals, W, Mo, Ta, Nb and alloys, refractory metals, tool steels.
Conditions and source
Book page 75, chapter 3, table 3.2, Base Metal-Brazing Filler Metal Combinations. The cells that carry this class for this base metal name these partners: Cu and Cu alloys, carbon and low-alloy steels, cast iron, stainless steel, Ni and Ni alloys, Ti and Ti alloys, Be, Zr, V and alloys, reactive metals, W, Mo, Ta, Nb and alloys, refractory metals, tool steels. A partner is what the cell pairs the base metal with, it does not index this entry. The table lists classes, it does not qualify them, and an empty cell is never a prohibition. The class is written as the document writes it, BAl-Si becoming BAlSi here, and it is never mapped to any grade of the corpus. The dagger printed by the document on this cell reads: special brazing filler metals are available and used successfully for specific metal combinations. The table names the family Cu and Cu alloys. The corpus carries only oxygen-free copper C10100 and C10200 under copper-ofe, so the entry is narrower than the cell it records.
AWS Brazing Handbook, American Welding Society, chapter 3 Brazing Filler Metals and chapter 33 Electron Tubes and Vacuum Equipment
Handbook of the American Welding Society. Three tables are read by the corpus. Table 3.2 page 75, Base Metal-Brazing Filler Metal Combinations, a two-entry matrix of base metal families whose cells carry AWS filler classes. Table 3.3 page 76, Maximum Service Temperatures Recommended for Various Brazing Filler Metal Compositions, one continuous and one short-term temperature per class. Table 33.1 page 585, Composition of Brazing Filler Metals Specially Produced for the Brazing of Vacuum Devices and Equipment, with liquidus and solidus in Fahrenheit and Celsius. The chapter, the table and the page of each statement are carried by the entry that uses it, never by this registry line.
- listedAWS class BAuThe AWS combination table lists the BAu class for brazing this base metal to Cu and Cu alloys, carbon and low-alloy steels, cast iron, stainless steel, Ni and Ni alloys, tool steels.
Conditions and source
Book page 75, chapter 3, table 3.2, Base Metal-Brazing Filler Metal Combinations. The cells that carry this class for this base metal name these partners: Cu and Cu alloys, carbon and low-alloy steels, cast iron, stainless steel, Ni and Ni alloys, tool steels. A partner is what the cell pairs the base metal with, it does not index this entry. The table lists classes, it does not qualify them, and an empty cell is never a prohibition. The class is written as the document writes it, BAl-Si becoming BAlSi here, and it is never mapped to any grade of the corpus. The table names the family Cu and Cu alloys. The corpus carries only oxygen-free copper C10100 and C10200 under copper-ofe, so the entry is narrower than the cell it records.
AWS Brazing Handbook, American Welding Society, chapter 3 Brazing Filler Metals and chapter 33 Electron Tubes and Vacuum Equipment
Handbook of the American Welding Society. Three tables are read by the corpus. Table 3.2 page 75, Base Metal-Brazing Filler Metal Combinations, a two-entry matrix of base metal families whose cells carry AWS filler classes. Table 3.3 page 76, Maximum Service Temperatures Recommended for Various Brazing Filler Metal Compositions, one continuous and one short-term temperature per class. Table 33.1 page 585, Composition of Brazing Filler Metals Specially Produced for the Brazing of Vacuum Devices and Equipment, with liquidus and solidus in Fahrenheit and Celsius. The chapter, the table and the page of each statement are carried by the entry that uses it, never by this registry line.
- listedAWS class BCuPThe AWS combination table lists the BCuP class for brazing this base metal to Cu and Cu alloys.
Conditions and source
Book page 75, chapter 3, table 3.2, Base Metal-Brazing Filler Metal Combinations. The cells that carry this class for this base metal name these partners: Cu and Cu alloys. A partner is what the cell pairs the base metal with, it does not index this entry. The table lists classes, it does not qualify them, and an empty cell is never a prohibition. The class is written as the document writes it, BAl-Si becoming BAlSi here, and it is never mapped to any grade of the corpus. The table names the family Cu and Cu alloys. The corpus carries only oxygen-free copper C10100 and C10200 under copper-ofe, so the entry is narrower than the cell it records.
AWS Brazing Handbook, American Welding Society, chapter 3 Brazing Filler Metals and chapter 33 Electron Tubes and Vacuum Equipment
Handbook of the American Welding Society. Three tables are read by the corpus. Table 3.2 page 75, Base Metal-Brazing Filler Metal Combinations, a two-entry matrix of base metal families whose cells carry AWS filler classes. Table 3.3 page 76, Maximum Service Temperatures Recommended for Various Brazing Filler Metal Compositions, one continuous and one short-term temperature per class. Table 33.1 page 585, Composition of Brazing Filler Metals Specially Produced for the Brazing of Vacuum Devices and Equipment, with liquidus and solidus in Fahrenheit and Celsius. The chapter, the table and the page of each statement are carried by the entry that uses it, never by this registry line.
- listedAWS class BNiThe AWS combination table lists the BNi class for brazing this base metal to Cu and Cu alloys, carbon and low-alloy steels, cast iron, stainless steel, Ni and Ni alloys, tool steels.
Conditions and source
Book page 75, chapter 3, table 3.2, Base Metal-Brazing Filler Metal Combinations. The cells that carry this class for this base metal name these partners: Cu and Cu alloys, carbon and low-alloy steels, cast iron, stainless steel, Ni and Ni alloys, tool steels. A partner is what the cell pairs the base metal with, it does not index this entry. The table lists classes, it does not qualify them, and an empty cell is never a prohibition. The class is written as the document writes it, BAl-Si becoming BAlSi here, and it is never mapped to any grade of the corpus. The table names the family Cu and Cu alloys. The corpus carries only oxygen-free copper C10100 and C10200 under copper-ofe, so the entry is narrower than the cell it records.
AWS Brazing Handbook, American Welding Society, chapter 3 Brazing Filler Metals and chapter 33 Electron Tubes and Vacuum Equipment
Handbook of the American Welding Society. Three tables are read by the corpus. Table 3.2 page 75, Base Metal-Brazing Filler Metal Combinations, a two-entry matrix of base metal families whose cells carry AWS filler classes. Table 3.3 page 76, Maximum Service Temperatures Recommended for Various Brazing Filler Metal Compositions, one continuous and one short-term temperature per class. Table 33.1 page 585, Composition of Brazing Filler Metals Specially Produced for the Brazing of Vacuum Devices and Equipment, with liquidus and solidus in Fahrenheit and Celsius. The chapter, the table and the page of each statement are carried by the entry that uses it, never by this registry line.
- listedAWS class RBCuZnThe AWS combination table lists the RBCuZn class for brazing this base metal to Cu and Cu alloys, carbon and low-alloy steels, cast iron, Ni and Ni alloys, tool steels.
Conditions and source
Book page 75, chapter 3, table 3.2, Base Metal-Brazing Filler Metal Combinations. The cells that carry this class for this base metal name these partners: Cu and Cu alloys, carbon and low-alloy steels, cast iron, Ni and Ni alloys, tool steels. A partner is what the cell pairs the base metal with, it does not index this entry. The table lists classes, it does not qualify them, and an empty cell is never a prohibition. The class is written as the document writes it, BAl-Si becoming BAlSi here, and it is never mapped to any grade of the corpus. The table names the family Cu and Cu alloys. The corpus carries only oxygen-free copper C10100 and C10200 under copper-ofe, so the entry is narrower than the cell it records.
AWS Brazing Handbook, American Welding Society, chapter 3 Brazing Filler Metals and chapter 33 Electron Tubes and Vacuum Equipment
Handbook of the American Welding Society. Three tables are read by the corpus. Table 3.2 page 75, Base Metal-Brazing Filler Metal Combinations, a two-entry matrix of base metal families whose cells carry AWS filler classes. Table 3.3 page 76, Maximum Service Temperatures Recommended for Various Brazing Filler Metal Compositions, one continuous and one short-term temperature per class. Table 33.1 page 585, Composition of Brazing Filler Metals Specially Produced for the Brazing of Vacuum Devices and Equipment, with liquidus and solidus in Fahrenheit and Celsius. The chapter, the table and the page of each statement are carried by the entry that uses it, never by this registry line.
Against another base metal, no filler named:
- not recommendedAl and Al AlloysThe AWS combination table does not recommend brazing this base metal to Al and Al Alloys.
Conditions and source
Book page 75, chapter 3, table 3.2, Base Metal-Brazing Filler Metal Combinations. The cell names no filler metal of any kind, neither a grade nor an AWS class. It states something about the combination of two base metals and nothing else. The document prints this reserve under the table and it is carried here in full: X means not recommended, however special techniques may be viable for certain dissimilar metal combinations. The table names the family Cu and Cu Alloys, and the corpus carries only oxygen-free copper C10100 and C10200 under copper-ofe. The table names the family Al and Al Alloys, and the corpus carries 6061.
AWS Brazing Handbook, American Welding Society, chapter 3 Brazing Filler Metals and chapter 33 Electron Tubes and Vacuum Equipment
Handbook of the American Welding Society. Three tables are read by the corpus. Table 3.2 page 75, Base Metal-Brazing Filler Metal Combinations, a two-entry matrix of base metal families whose cells carry AWS filler classes. Table 3.3 page 76, Maximum Service Temperatures Recommended for Various Brazing Filler Metal Compositions, one continuous and one short-term temperature per class. Table 33.1 page 585, Composition of Brazing Filler Metals Specially Produced for the Brazing of Vacuum Devices and Equipment, with liquidus and solidus in Fahrenheit and Celsius. The chapter, the table and the page of each statement are carried by the entry that uses it, never by this registry line.
- not recommendedMg and Mg AlloysThe AWS combination table does not recommend brazing this base metal to Mg and Mg Alloys.
Conditions and source
Book page 75, chapter 3, table 3.2, Base Metal-Brazing Filler Metal Combinations. The cell names no filler metal of any kind, neither a grade nor an AWS class. It states something about the combination of two base metals and nothing else. The document prints this reserve under the table and it is carried here in full: X means not recommended, however special techniques may be viable for certain dissimilar metal combinations. The table names the family Cu and Cu Alloys, and the corpus carries only oxygen-free copper C10100 and C10200 under copper-ofe.
AWS Brazing Handbook, American Welding Society, chapter 3 Brazing Filler Metals and chapter 33 Electron Tubes and Vacuum Equipment
Handbook of the American Welding Society. Three tables are read by the corpus. Table 3.2 page 75, Base Metal-Brazing Filler Metal Combinations, a two-entry matrix of base metal families whose cells carry AWS filler classes. Table 3.3 page 76, Maximum Service Temperatures Recommended for Various Brazing Filler Metal Compositions, one continuous and one short-term temperature per class. Table 33.1 page 585, Composition of Brazing Filler Metals Specially Produced for the Brazing of Vacuum Devices and Equipment, with liquidus and solidus in Fahrenheit and Celsius. The chapter, the table and the page of each statement are carried by the entry that uses it, never by this registry line.
Chemical affinity
What documents state about a BINARY SYSTEM, one element of a filler metal faced with one element of this material. An affinity is not a verdict on a joint: a joint brings many binaries together at once, some helpful and some harmful, and what follows is the list of those the corpus can name. The count below is not written anywhere. It falls out of the crossing of this material's elements with the composition of every filler the corpus holds, so it grows on its own the day a binary enters the corpus.
Elements of this material: Cu, the material is the element.
brittle intermetallic9 fillersTi against Cu1 source+1 statement
The two elements combine into a compound that is harder and less tolerant of strain than either of them. It sits in the filler, in the base next to the interface, or in both.
9 fillers: 35Au-62Cu-2Ti-1Ni, 48Ti-48Zr-4Be, 49Ti-49Cu-2Be, 56Zr-28V-16Ti, 71.5Ti-28.5Ni, Cusil-ABA, Cusin-1 ABA, Incusil-ABA, Ticusil
Conditions and verbatim
Book page 147, same set of conclusions as ti--fe--schwartz147. The chapter states that not all intermetallics are necessarily hard and detrimental to the properties of the joint, and gives as its example that Ti2Cu was present in the filler metal but did not deteriorate the mechanical properties of the brazed joints. Written because the corpus must be able to serve a mechanism WITHOUT serving an alarm: the same mechanism code carries both this entry and ti--fe--schwartz147, and only the enonce distinguishes them. A reader who sees brittle intermetallic on Ti against Cu and reads no further would take away the opposite of what the document says.
Source[A] M. M. Schwartz, Brazing, 2nd edition, ASM International, 2003, chapter 4, Base Metals and Base-Metal Family Groups, DOI 10.1361/brse2003p063
Source conditionsChapter 4 of the second edition, book pages 63 to 162 in the copy read, which treats base metals family by family and states metallurgical reactions, atmosphere limits and filler selection guides. It is a handbook chapter, not a qualification record. The page of each statement is carried by the entry that uses it, never by this registry line.
Outgassing
10 sourced measurements for this card, 1 prescribed condition or published threshold. A rate means nothing without the pumping time it was read at, so each one states it or declares it missing. The whole base, filters included, is at /tools/outgassing/.
Signature: 1e-7 unbaked to 1e-14 baked, a drop of 6.7 decades.
| Material as published | Species | State | Pumping time | Rate |
|---|---|---|---|---|
| OFS copper (oxygen-free silver-bearing) | H2 | baked | not applicable, the source states the rate independent of pumping time | 3.00e-14mbar·L/s/cm² |
| Copper Silver added (OFS) | H2 | baked | not applicable, the source states the rate independent of pumping time | about1.00e-14mbar·L/s/cm² |
| Copper Silver added (OFS) | H2 | baked | not applicable, the source states the rate independent of pumping time | 3.00e-12mbar·L/s/cm² |
| copper and aluminium alloys | H2 | baked | not applicable, the source states the rate independent of pumping time | less than1.00e-13mbar·L/s/cm² |
| Copper (elemental and OFHC) | total | unbaked | NOT STATED by the source | 5.60e-9mbar·L/s/cm² |
| Copper (fresh) | total | unbaked | the abscissa of the curve below | 5.33e-8 at 1 h to 5.53e-9 at 10 h |
| Copper (mech. polished) | total | unbaked | the abscissa of the curve below | 4.67e-9 at 1 h to 4.75e-10 at 10 h |
| OFHC copper (fresh) | total | unbaked | the abscissa of the curve below | 2.51e-8 at 1 h to 1.68e-9 at 10 h |
| OFHC copper (mech. polished) | total | unbaked | the abscissa of the curve below | 2.53e-9 at 1 h to 2.17e-10 at 10 h |
| Copper | total | baked | NOT STATED by the source | 1.47e-12mbar·L/s/cm² |
Prescribed, not measured
- procedure, Copper and copper alloys, including OFHC, beryllium copper and aluminium bronze, excluding phosphor bronze. Bake 200 C, 48 h, vacuum.
Sources: S-CHIGGIATO-CAS-2017, S-LIGO-E960050-V13, S-LIGO-E960022-V24, S-ELSEY-1975-II. Full citations and conditions at the base and in /data/outgassing.json.
Grades
| C10100 (OFE, 99.99) | hydrogen-braze safe, RF and gasket reference grade |
|---|---|
| C10200 (OF, 99.95) | general OF hardware where C10100 certs are overkill |
| C11000 (ETP) | banned from hydrogen brazing and vacuum firing: oxygen blisters |
| C14500 (TeCu) | free machining via tellurium: acceptable, but confirm on the drawing, never for brazing-critical parts |
Sources · 1
Used by
Tools
- Brazing Abacuscopper OFE
- Brazing Route Enginecopper OFE
- Outgassing base